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Rescission of the Final Scientific Integrity Policy of the National Institutes of Health
The purpose of this Notice is to rescind the Final Scientific Integrity Policy of the National Institutes of Health (NIH), issued under NOT-OD-24-178, to ensure alignment with the Administrations priorities. The NIH remains committed to upholding the principles of scientific integrity and has multiple interlocking policies that support and promote scientific integrity across the agency, including policies on research misconduct, authorship, human and animal subject protections, and data management and sharing, which will continue. This Notice only applies to the Final Scientific Integrity Policy of the NIH and not to any policies cited therein. Additionally, the NIH will adhere to the HHS Scientific Integrity Policy to advance scientific integrity goals.
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Implementation Update: Delayed Effective Date for the NIH Intramural Research Program Access Planning Policy
On January 10, 2025, NIH issued the Intramural Research Program (IRP) Access Planning Policy (NOT-OD-25-062) requiring organizations applying to NIH for certain commercial patent licenses to submit access plans to NIH outlining steps they intend to take to promote patient access to those licensed products. The IRP Access Planning Policy applies to license applications and licenses granted by the NIH IRP for patents wholly owned by the government.
The NIH is committed to working with organizations to ensure successful implementation of this Policy. As such, NIH is delaying the effective date to accommodate further stakeholder outreach discussion in developing meaningful access approaches and incentive for partnerships. The Policy will now apply to license applications submitted to NIH on or after October 1, 2025.
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A team of researchers has developed a groundbreaking high-temperature copper alloy with exceptional thermal stability and mechanical strength. The research team’s findings on the new copper alloy introduce a novel bulk Cu-3Ta-0.5Li nanocrystalline alloy that exhibits remarkable resistance to coarsening and creep deformation, even at temperatures near its melting point.
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Researchers have discovered a way to protect quantum information from environmental disruptions, offering hope for more reliable future technologies.
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