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The College of Engineering’s Fellow to Faculty program will recruit top scholars and academicians providing innovative solutions, technologies, and problem solving for emerging co-designed physical and computational systems including:

Heterogeneous integration or advanced packaging of semiconductor -chips for the next generation of multidimensional electronic and photonic integrated circuits for electrification of transportation, renewable energy systems, AI, or other applications. Cyber-physical systems, encompassing control theory, real-time and embedded systems, computing protocols, sensor networks, robotics, and machine learning applied to the integration of computational algorithms and physical processes; Foundational aspects and methods in Machine Learning; Applications of machine learning in cybersecurity, AI for materials discovery, design, and deployment, AI-enabled inverse design tools that accelerate the discovery of advanced materials for improved performance and energy-efficient manufacturing.

Fellows will hold a disciplinary appointment in one of more of the following College of Engineering departments: Electrical &

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