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A new technique for creating simple electronic device components proved effective in recent tests. The results show that self-assembly for more complicated electronics, like 3D computer chips, could be possible. 

The findings are published in Materials Horizons and supported by the U.S. National Science Foundation Center for Complex Particle Systems. The technique exhibits a relatively “passive” creation process compared to current industry methods, eliminating the need for high-cost robotic or manual labor.  

The method explores arrays of transistors and diodes for now but could be used to fabricate more complex structures, such as 3D chips, in the future. 

Martin Thuo is a professor of materials science and engineering at North Carolina State University and an author of the study. Says Thuo, “Existing chip manufacturing techniques involve many steps and rely on extremely complex technologies, making the process costly and time-consuming. Our self-assembling approach is significantly faster and less expensive.” 

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Scientists have developed something long thought impossible: a polymer that’s both stiff and stretchable, without one quality compromising the other. Materials research has shown that the stiffer a polymer, the less flexible it will be — but no longer. 

The findings are published in the journal Science Advances and supported by the U.S. National Science Foundation. The University of Virginia research team behind these findings shows that strength and “stretchability” don’t necessarily have to be opposites when it comes to polymers.  

Liheng Cai, assistant professor of materials research and principal investigator of an NSF Faculty Early Career Development award, says, “We are addressing a fundamental challenge that has been thought to be impossible to solve since the invention of vulcanized rubber in 1839.” The research was led by doctoral student Baiqiang Huang.  

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The U.S. National Science Foundation and The Lemelson Foundation have awarded funding through the NSF Research in the Formation of Engineers program for five projects to integrate sustainability topics into engineering curricula. Supported in part by a $3 million, three-year investment from The Lemelson Foundation, this partnership aims to prepare future engineers to address critical challenges like infrastructure resilience, clean energy and the growth of emerging industries and manufacturing.

“These projects from the NSF-Lemelson initiative will help prepare engineering students to consider sustainability as they address complex challenges for our nation’s industry, infrastructure and health,” said Susan Margulies, NSF assistant director for Engineering. “The curricula and training that result will empower and inspire engineering students to make a difference in their communities.”

Each project offers a unique approach to advancing responsible engineering education. North Carolina A&T State University will incorporate environmental and social considerations throughout its industrial and systems engineering curriculum.  Researchers at the University of Arizona and the University of Michigan are exploring strategic prompts in coursework to inspire design decisions that prioritize environmental impact. Arizona State University, in collaboration with Kennesaw State University and Villanova University, is developing a network to support educators in enhancing sustainable engineering instruction. Rochester Institute of Technology will introduce activities aimed at helping students adopt a more eco-conscious engineering mindset, while Harvey Mudd College’s systems thinking framework

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