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A new technique for creating simple electronic device components proved effective in recent tests. The results show that self-assembly for more complicated electronics, like 3D computer chips, could be possible. 

The findings are published in Materials Horizons and supported by the U.S. National Science Foundation Center for Complex Particle Systems. The technique exhibits a relatively “passive” creation process compared to current industry methods, eliminating the need for high-cost robotic or manual labor.  

The method explores arrays of transistors and diodes for now but could be used to fabricate more complex structures, such as 3D chips, in the future. 

Martin Thuo is a professor of materials science and engineering at North Carolina State University and an author of the study. Says Thuo, “Existing chip manufacturing techniques involve many steps and rely on extremely complex technologies, making the process costly and time-consuming. Our self-assembling approach is significantly faster and less expensive.” 

Credit: Julia Chang

These microscopic objects were self-assembled using the new technique which the researchers refer to as a directed metal-ligand reaction or D-Met. So far, the technique can be used to create diodes, transistors and other simple electronic components.

“What’s more, current manufacturing techniques have low yield, meaning they produce a relatively large number of faulty chips that can’t be used,” adds Thuo. “Our approach

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RSS feed source: National Science Foundation

l’Université Concordia
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Située sur le territoire traditionnel et non cédé du peuple Kanien’kehá:ka, l’Université Concordia est la meilleure université nord-américaine de moins de 50 ans, reconnue pour son apprentissage transformateur, sa pensée convergente et son impact sur le public.

L’École de génie et d’informatique Gina-Cody de l’Université Concordia lance un appel à candidatures pour des postes a temps plein dans les départements suivants:

Département de génie du bâtiment, civil et environnemental (BCEE)
Institut d’ingénierie des systèmes d’informati on de Concordia (CIISE)
Département de génie chimique et des matériaux(CME)
Département d’informatique et de génie logiciel (CSSE)
Département de génie électrique et informatique (ECE)
Département de génie mécanique, industriel et aérospatial (MIAE)

Pour des informations détaillées sur les postes et comment postuler, veuillez consulter:
https://www.concordia.ca/fr/gina-cody/a-propos/carrieres.html

L’École de génie et d’informatique Gina-Cody de l’Université Concordia se classe parmi les dix meilleurs établissements du genre au Canada. Accueillant plus de 10 000 étudiantes et

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TALLAHASSEE, Fla. – FEMA has obligated over $1 billion in Public Assistance funds to aid Florida’s recovery from Hurricane Milton. Reaching this milestone, in just over two months after the hurricane’s major disaster declaration on Oct. 11, has never been done before in Florida. This rapid response highlights the partnership with the State of Florida to aid local governments’ efforts to help communities recover.

These funds include costs that the state and local jurisdictions spent on debris removal and emergency protective measures. As of Dec. 20, the state of Florida has removed 37.4 million cubic yards of debris, which equals to more than 228,000 tractor trailers loads.

FEMA’s Public Assistance program provides reimbursement to state and local government agencies for the costs of emergency response, debris removal and restoration of disaster-damaged public facilities and infrastructure. Houses of worship and certain private nonprofit organizations may also be eligible for FEMA Public Assistance. The deadline to apply for Public Assistance funds is Dec. 20, 2024.

For the latest information about Hurricane Milton recovery, visit fema.gov/disaster/4834. For Hurricane Helene, visit fema.gov/disaster/4828. For Hurricane Debby, visit fema.gov/disaster/4806. Follow FEMA on X at x.com/femaregion4 and on Facebook at facebook.com/fema.

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FEMA’s mission is helping people before, during, and after disasters. FEMA is committed to ensuring disaster assistance is accomplished equitably, without discrimination on the grounds of race, color, nationality, sex, sexual orientation, religion,

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Notice of Informational Webinar on the NIH Advancing Research Careers (ARC) Program Notices of Funding Opportunity (F99/K00 and UE5)

The purpose of this Notice is to inform potential applicants to the Advancing Research Careers (ARC) program of an upcoming webinar on planning submissions to the F99/K00 (PAR-25-084) and UE5 (PAR-23-221) Notices of Funding Opportunity (NOFOs). Please note that the F99/K00 NOFO was recently reissued in response to NIH-wide changes in the Fellowship Application and Review process.

Participation in the webinar, although encouraged, is optional and not required for application submission.

For more about the ARC Program, please visit: https://nigms.nih.gov/training/arc.

Webinar Information

Topic: Preparing an Application to the NIH Advancing Research Careers (ARC) Program

During this webinar, you will learn about the ARC program and the process for writing a UE5 or F99/K00 application. 

Date: Tuesday, January 7, 2025

Time: 3:00 – 4:00 pm EST

Join

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