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U.S. National Science Foundation

Directorate for Engineering
     Division of Electrical, Communications and Cyber Systems

Intel Corporation

Full Proposal Deadline(s) (due by 5 p.m. submitting organization’s local time):

     January 22, 2025

Important Information And Revision Notes

Revisions from NSF 23-541 include: 

Submission of a Letter of Intent (LOI) is not required for this ASCENT competition. The program now accepts both types of collaborative proposals described in Chapter II.E.3 of the NSF Proposal & Award Policies & Procedures Guide. The topic at the heart of the proposal must lie within the scopes of at least two of the three ECCS clusters (CCSS, EPMD, EPCN). Research proposals spanning three clusters are highly encouraged. In FY25 ASCENT will focus on wafer-scale or panel-scale heterogeneous integration of innovative semiconductor systems through advanced packaging. Novel ideas to advance wafer-scale or panel-scale heterogeneous integration technologies are also encouraged. Intel is a funding partner.

Any proposal submitted in

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